✨ About The Role
- The position involves performing conceptual and detailed mechanical design of high-density electronic packaging designs and electronic components for space and airborne defense applications.
- Responsibilities include designing electronic packaging chassis and structures, interconnects, and thermal control designs for high-density electronic systems.
- The candidate will need to adhere to design constraints related to size, weight, and power, as well as design to cost.
- The role requires following established procedures in the creation of technical data packages and design guidelines.
- Collaboration with program and functional supervision is essential to ensure overall design objectives are met.
âš¡ Requirements
- The ideal candidate will have a minimum of 10 years of experience in mechanical engineering design and product support, with a preference for those who have held leadership roles.
- A strong ability to apply high-level principles, theories, and concepts within the mechanical engineering field is essential.
- Candidates should possess direct experience in developing detailed mechanical designs and documentation packages for RF, electronic, and/or mechanical systems.
- Proficiency in Geometric Dimensioning and Tolerance analysis for drawings is required.
- Familiarity with PTC CREO (Pro/Engineer) modeling and analysis tools is necessary for success in this role.